2.13 New Technology to Fabricate 3-Dimensional Carbon Fiber Composites
-Heat Conduction Is Better Than That of Copper Metal-


magnified picture
Fig. 2-22
Fabrication processes of a
3-dimensional carbon fiber composite (CFC)
Keplar fiber: the fiber vanishes at temperatures
higher than 400 degrees on carbonization
Pitch: carbon chemical compound

Fig. 2-23
The relation between heat conductivity and temperature for carbon fiber composites
œ : NIC-01, ¢, : NIC-02 are newly developed CFCs. Other marks designate exciting CFCs. Rho designates the weight per 1 cc of materials.


Carbon fiber composites are used for various purposes, due to their excellent characteristics. Carbon is a light element, and has the ability to withstand heat and stress. Thus, it is one of the candidates for the divertor surface plates in a nuclear fusion reactor. The divertor plates have to exhaust heat and particles from the core plasma. A carbon fiber composite is usually fabricated as follows: a felt-like fiber is soaked in carbon pitch and then baked at high temperature. This process is repeated many times to achieve the required mass density and homogeneity and etc., that are needed for high performance characteristics. Many bakings are expensive in terms of electricity. A structure of the 3-dimensional carbon fiber textile is first constructed. Carbon pitch is then infiltrated by High temperature Isotropic Pressing (HIP). This procedure is shown in Fig. 2-22. HIP was first developed for metal joints. It is the first experience to use HIP for carbon fiber composites. It is demonstrated that HIP at 2,000 degrees, 200 MPa is very effective to get a required mass density and heat conductivity. The relationship between material temperature and heat conductivity is shown for various trial test pieces. Material design technologies make remarkable improvements by the application of technology developed in the other fields.


Reference
M. Araki et al., Development of 3D Based CFC with High Thermal Conductivity for Fusion Application, Proc. 19th Symp. on Fusion Technology, Sep. 16-20, 1996, Lisbon, 359 (1997).

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